Article 5: Components of the Initiative
1. The Initiative shall have the following five components:
(a) design capacities for integrated semiconductor technologies;
(b) pilot lines for preparing innovative production, and testing and experimentation facilities;
(c) advanced technology and engineering capacities for quantum chips;
(d) a network of competence centres and skills development;
(e) 'Chips Fund' activities for access to debt financing and equity to start-ups, scale-ups, SMEs and other companies in the semiconductor value chain.
Note: This is not the final text of the European Chips Act. This is the text of the European Chips Act Proposal of February 2022.